Composite electronic component and method of manufacturing the same

ABSTRACT

A composite electronic component includes a multilayer wiring block having a plurality of insulating layers and a wiring pattern, and a chip-type electronic component built-in multilayer block having a plurality of insulating payers and a wiring pattern and including a first chip-type electronic component. The multilayer wiring block and the chip-type electronic component built-in multilayer block are electrically interconnected and arranged on substantially the same plane.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to composite electronic components andmethods for manufacturing the composite electronic components. Moreparticularly, the present invention relates to a composite electroniccomponent in which a plurality of types of substrates having differentcharacteristics are integrated to provide a desired function and toachieve miniaturization and profile reduction, and to a method ofmanufacturing the composite electronic component.

2. Description of the Related Art

In recent years, with miniaturization and enhancement of functions ofmobile communication devices, such as portable phones and electronicdevices, miniaturization and enhancement of functions of electroniccomponents have rapidly progressed. For example, in Japanese Patent No.3375555 (Patent Document 1), a circuit component built-in module havinga circuit components built therein and being modularized and a method ofmanufacturing the circuit component built-in module are disclosed.

The circuit component built-in module described in Patent Document 1includes an electrical insulating substrate made of a mixture includingan inorganic filler and a thermosetting resin, a plurality of wiringpatterns disposed on at least one major surface of the electricalinsulating substrate, and a circuit component embedded in the electricalinsulating substrate and electrically connected to the wiring patterns.The circuit component and the wiring patterns are electrically connectedthrough conductive adhesive or bumps. In addition, in Patent Document 1,a circuit component built-in module having a multilayer structure inwhich a plurality of electrical insulating substrates are laminated isdisclosed. In Patent Document 1, an inner via connection method is usedto increase the density and enhance the functions of the circuitcomponent. In addition, a mixture including an inorganic filler and athermosetting resin is used as a material for making the electricalinsulating substrate, in order to increase reliability.

However, in a conventional composite electronic component, as in thecircuit component built-in module described in Patent Document 1, aplurality of wiring patterns are disposed on at least one major surfaceof an electrical insulating substrate, and a circuit component connectedto these wiring patterns is embedded in the electrical insulatingsubstrate. Thus, when a plurality of different types of circuitcomponents are built into the electrical insulating substrate so thatthe electrical insulating substrate has various functions, the heightsof the circuit components are limited to the height of the electricalinsulating substrate. In addition, since it is difficult to arrange awiring layer inside the electrical insulating substrate in which thecircuit components are embedded, despite the presence of high-densitywiring, it is inevitable that the wiring layer has to be provided on thetop or bottom surface of the electrical insulating substrate. Thus,there has been a problem in that it is difficult to reduce the profileof a composite electronic component.

SUMMARY OF THE INVENTION

To overcome the problems described above, preferred embodiments of thepresent invention provide a composite electronic component in whichvarious substrates and electric components having different functionsare combined to provide various functions which achieve miniaturizationand profile reduction, and provide a method of manufacturing thecomposite electronic component.

A composite electronic component according to a preferred embodiment ofthe present invention includes at least two of a multilayer wiring blockhaving a plurality of laminated insulating layers and a wiring pattern,a chip-type electronic component built-in multilayer block having aplurality of laminated insulating layers and including a first chip-typeelectronic component, and a second chip-type electronic componentincluding a passive component or an active component. In this compositeelectronic component, at least two of the multilayer wiring block, thechip-type electronic component built-in multilayer block, and the secondchip-type electronic component are electrically interconnected andarranged on substantially the same plane.

In a composite electronic component according to this preferredembodiment, at least two of the multilayer wiring block, the chip-typeelectronic component built-in multilayer block, and the second chip-typeelectronic component are integrated by a resin.

At least two of the multilayer wiring block, the chip-type electroniccomponent built-in multilayer block, and the second chip-type electroniccomponent are preferably mounted on a supporting substrate having asurface wiring pattern.

In the composite electronic component according to this preferredembodiment, the multilayer wiring block, the chip-type electroniccomponent built-in multilayer block, and the second chip-type electroniccomponent are preferably included.

At least two of the multilayer wiring block, the chip-type electroniccomponent built-in multilayer block, and a chip-type electroniccomponent block in which the second chip-type electronic component areresin-sealed are preferably integrated by a resin block.

The resin block preferably includes a connecting wiring for electricallyinterconnecting at least two of the multilayer wiring block, thechip-type electronic component built-in multilayer block, and thechip-type electronic component block.

In a composite electronic component according to this preferredembodiment of the present invention, the multilayer wiring block, thechip-type electronic component built-in multilayer block, and thechip-type electronic component block are preferably integrated by aresin block.

In a composite electronic component according to this preferredembodiment, the multilayer wiring block and the chip-type electroniccomponent built-in multilayer block are preferably made of differentmaterials.

A method of manufacturing a composite electronic component according toanother preferred embodiment of the present invention includes the stepsof mounting at least two of a multilayer wiring block having a pluralityof laminated insulating layers and a wiring pattern, a chip-typeelectronic component built-in multilayer block having a plurality oflaminated insulating layers and including a first chip-type electroniccomponent, and a second chip-type electronic component, on a supportingsubstrate having a surface wiring pattern, covering at least two of themultilayer wiring block, the chip-type electronic component built-inmultilayer block, and the second chip-type electronic component, with aresin sheet, and press-bonding the resin sheet to the at least two ofthe multilayer wiring block, the chip-type electronic component built-inmultilayer block, and the second chip-type electronic component.

In a method of manufacturing a composite electronic component accordingto this preferred embodiment, the steps of mounting each of themultilayer wiring block, the chip-type electronic component built-inmultilayer block, and a second chip-type electronic component on asupporting substrate having a surface wiring pattern, covering themultilayer wiring block, the chip-type electronic component built-inmultilayer block, and the second chip-type electronic component, with aresin sheet, and press-bonding the resin sheet to the multilayer wiringblock, the chip-type electronic component built-in multilayer block, andthe second chip-type electronic component are preferably included.

A method of manufacturing a composite electronic component according toanother preferred embodiment of the present invention includes the stepsof arranging at least two of a multilayer wiring block having aplurality of laminated insulating layers and a wiring pattern, achip-type electronic component built-in multilayer block having aplurality of laminated insulating layers and including a first chip-typeelectronic component, and a chip-type electronic component block inwhich a second chip-type electronic component is resin-sealed, and aresin block having a wiring pattern, and press-bonding and electricallyinterconnecting at least two of the multilayer wiring block, thechip-type electronic component built-in multilayer block, and the secondchip-type electronic component, by the resin block.

In a method of manufacturing a composite electronic component accordingto this preferred embodiment, the steps of arranging each of themultilayer wiring block, the chip-type electronic component built-inmultilayer block, the chip-type electronic component block, and theresin block, and press-bonding and electrically interconnecting themultilayer wiring block, the chip-type electronic component built-inmultilayer block, and the second chip-type electronic component, throughthe resin block are preferably included.

According to preferred embodiments of the present invention, a compositeelectronic component is provided in which various substrates andelectronic components having different functions are combined, so as toprovide various functions and achieve miniaturization and profilereduction and a method of manufacturing the composite electroniccomponent.

Other features, elements, steps, characteristics and advantages of thepresent invention will become more apparent from the following detaileddescription of preferred embodiments thereof with reference to theattached drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A and 1B show diagrams illustrating a preferred embodiment of acomposite electronic component of the present invention. FIG. 1A is across-sectional diagram of the composite electronic component, and FIG.1B is a cross-sectional diagram showing an enlarged view of a portion ofthe composite electronic component.

FIG. 2A-2C show perspective diagrams illustrating a manufacturing methodof the composite electronic component illustrated in FIGS. 1A and 1B inthe order of steps.

FIGS. 3A and 3B show cross-sectional diagrams in the steps illustratedin FIGS. 2A-2C. FIG. 3A is a diagram illustrating a state in which amultilayer wiring block and other components are provided on asupporting substrate, and FIG. 3B is a diagram illustrating a state inwhich a resin sheet is press-bonded.

FIG. 4 is a cross-sectional diagram illustrating another preferredembodiment of a composite electronic component of the present invention.

FIG. 5 is a cross-sectional diagram illustrating a further preferredembodiment of a composite electronic component of the present invention.

FIG. 6 is a cross-sectional diagram illustrating a further preferredembodiment of a composite electronic component of the present invention.

FIG. 7 is a cross-sectional diagram illustrating a further preferredembodiment of a composite electronic component of the present invention.

FIG. 8 is a cross-sectional diagram illustrating a further preferredembodiment of a composite electronic component of the present invention.

FIGS. 9A and 9B show diagrams illustrating a further preferredembodiment of a composite electronic component of the present invention.FIG. 9A is a perspective diagram illustrating major portions of steps inanother preferred embodiment of a manufacturing method of a compositeelectronic component of the present invention, and FIG. 9B is across-sectional diagram illustrating a composite electronic componentcreated in accordance with the manufacturing method illustrated in FIG.9A.

FIG. 10 is a perspective diagram illustrating a further preferredembodiment of a composite electronic component of the present invention.

FIG. 11 is a perspective diagram illustrating a further preferredembodiment of a composite electronic component of the present invention.

FIG. 12 is a crass-sectional diagram illustrating a further preferredembodiment of a composite electronic component of the present invention.

FIG. 13 is a crass-sectional diagram illustrating a further preferredembodiment of a composite electronic component of the present invention.

FIG. 14 is a crass-sectional diagram illustrating a further preferredembodiment of a composite electronic component of the present invention.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS First Preferred Embodiment

In the following, the present invention will be described with referenceto preferred embodiments illustrated in FIG. 1 to FIG. 14.

As illustrated in FIGS. 1A and 1B, a composite electronic component 10of the present preferred embodiment includes a multilayer wiring block11, a chip-type electronic component built-in multilayer block 12including a first chip-type electronic component 12A therein, a secondchip-type electronic component 13, a supporting substrate 14 havingthese three parts 11, 12, and 13 disposed thereon and supporting thesethree parts, and a resin portion 15 sealing the multilayer wiring block11, the chip-type electronic component built-in multilayer block 12, andthe second chip-type electronic component 13 on the supporting substrate14 so as to integrate these three parts. The multilayer wiring block 11,the chip-type electronic component built-in multilayer block 12, and thesecond chip-type electronic component 13 are electrically interconnectedon the supporting substrate 14 via a surface wiring pattern 14A providedon the surface of the supporting substrate 14.

The multilayer wiring block 11 is made by dividing a wiring portion ofthe composite electronic component 10 into blocks. The multilayer wiringblock 11 is a block defining a passive functional portion as a wiringpattern. As illustrated in FIG. 1A, for example, this multilayer wiringblock 11 has a laminated body including a plurality of laminatedinsulating layers 11A and a wiring pattern 11B disposed inside thelaminated body in a predetermined pattern. This wiring pattern 11Bincludes a plurality of inner conducting planes 11C each arrangedbetween the individual insulating layers 11A, and via hole conductors11D each penetrating the individual insulating layers 11A andelectrically connecting upper and lower inner conducting planes 11C. Themultilayer wiring block 11 may include a passive element, such as aninductor, capacitor, or other suitable passive element, connected toappropriate inner conducting planes 11C. The multilayer wiring block 11is connected to the surface wiring pattern 14A of the supportingsubstrate 14 through an external terminal electrode 11E disposed on thebottom surface of the multilayer wiring block 11.

The insulating layers 11A may be made, for example, of a thermosettingresin such as an epoxy resin, a phenolic resin, and a cyanate resin. Inthis case, the multilayer wiring block 11 may be formed using, forexample, a build-up method, and the inner conducting planes 11C may beformed by patterning metal foil such as copper foil, for example. Thevia hole conductors 11D may be formed by filling via holes disposed inthe insulating layers 11A with conductive paste. The conductive paste isa conductive resin composition including, for example, metal particlesand a thermosetting resin. For the metal particles, a metal such asgold, silver, copper, and nickel, for example, may be used. For thethermosetting resin, a resin such as an epoxy resin, a phenolic resin,and a cyanate resin, for example, may be used.

In addition, the insulating layers 11A may be made of a ceramic materialhaving low conductivity. For the ceramic material, a low temperaturesintering ceramic material is preferred. For the low temperaturesintering ceramic material, ceramic powder such as alumina, forsterite,and cordierite, a glass composite material including borosilicate glassmixed with such ceramic powder, a crystallized glass material usingcrystallized glass of the ZnO—MgO—Al₂O₃—SiO₂ system, and a non-glassmaterial using ceramic powder of the BaO—Al₂O₃—SiO₂ system, ceramicpowder of the Al₂O₃—CaO—SiO₂—MgO—B₂O₃ system, for example, may be used.In these cases, the inner conducting planes 11C and the via holeconductors 11D may be integrated by co-firing of a metal having a lowresistance and a low melting point such as Ag, Cu, with a lowtemperature sintering ceramic material, at a low temperature.

The chip-type electronic component built-in multilayer block 12, similarto the multilayer wiring block 11, is a block functioning primarily as apassive functional portion of the composite electronic component 10. Asillustrated in FIGS. 1A and 1B, the chip-type electronic componentbuilt-in multilayer block 12 includes a first chip-type electroniccomponent 12A and is formed as a laminated body having a plurality oflaminated insulating layers 12B, inside of which a wiring pattern 12C isdisposed, similar to the multilayer wiring block 11.

The first chip-type electronic component 12A is made of a ceramicsintered body such as a chip-type condenser, a chip-type inductor, and achip-type resistor, for example. The insulating layers 12B arepreferably made primarily of a mixture of an inorganic filler and athermosetting resin such as an epoxy resin. The insulating layers 12Bmay be formed of a material different from the material from which theabove-described insulating layers 11A are formed, such as a ceramic anda resin, or an epoxy resin including an epoxy resin and an inorganicfiller. As illustrated in FIG. 2B, the wiring pattern 12C includes, forexample, a plurality of inner conducting planes 12D each providedbetween the individual insulating layers 12B, via hole conductors 12Eeach penetrating the individual insulating layers 12B and electricallyconnecting an upper and a lower inner conducting planes 12D, a firstexternal terminal electrode 12F disposed on the bottom surface of thelaminated body, and a second external terminal electrode 12G disposed onthe top surface of the laminated body. The first chip-type electroniccomponent 12A is disposed at an appropriate position on the innerconducting planes 12D. The chip-type electronic component built-inmultilayer block 12 is connected to the surface wiring pattern 14A ofthe supporting substrate 14 through the first external terminalelectrode 12F disposed on the bottom surface. An active element such asa silicon semiconductor may be provided in the second external terminalelectrode 12G on the top surface of the chip-type electronic componentbuilt-in multilayer block 12 as necessary.

The second chip-type electronic component 13 is defined, for example, bya passive element made from a ceramic sintered body or an active elementmade from a silicon semiconductor, and is electrically connected to thesurface wiring pattern 14A of the support body 14 through the externalterminal electrode 13A provided on the bottom surface, as illustrated inFIG. 1A. This second chip-type electronic component 13 is electricallyinterconnected through the supporting substrate 14 to and cooperateswith the multilayer wiring block 11 and the chip-type electroniccomponent built-in multilayer block 12, thus providing various functionsin the composite electronic component 10.

The second chip-type electronic component 13 and the first chip-typeelectronic component 12A included in the chip-type electronic componentbuilt-in multilayer block 12 are basically classified according to size.It is difficult to build a chip-type electronic component in a laminatedbody if the thickness, length, and width of the chip-type electroniccomponent are greater than about 0.8 mm, about 1.6 mm, and about 0.8 mm,respectively. Thus, such a chip-type electronic component is arrangedalong with the multilayer wiring block 11, as the second chip-typeelectronic component 13. Accordingly, a chip-type electronic componenthaving a size smaller than the above size is built in the chip-typeelectronic component built-in multilayer block 12 and used as the firstchip-type electronic component 12A.

The supporting substrate 14 may be, but not particularly limited to, aresin multilayer substrate or a ceramic multilayer substrate, forexample, as long as it has a surface wiring pattern 14A.

As described above, according to the present preferred embodiment, thecomposite electronic component 10 is provided with the multilayer wiringblock 11, the chip-type electronic component built-in multilayer block12, and the second chip-type electronic component 13, each having adifferent function. These are electrically interconnected and arrangedon the same plane, and thus, the composite electronic component 10provides a plurality of functions to achieve enhanced functions,miniaturization, and profile reduction of substrates.

Further, according to the present preferred embodiment, the insulatinglayers 11A of the multilayer wiring block 11 and the insulating layers12B of the chip-type electronic component built-in multilayer block 12may be made of different materials. For example, an organic material isused for one and an inorganic material is used for the other. Thus, evenif the composite electronic component 10 is mounted on the supportingsubstrate 14 made of a different type of material, the residual stressesof the individual blocks 11 and 12 that define the composite electroniccomponent 10 are different from each other. Each of the residualstresses can be relaxed on the supporting substrate 14, which suppressesnegative effects of physical characteristics, such as strain, and thusincreases reliability.

Next, referring to FIGS. 2A-3B, a preferred embodiment of a method ofmanufacturing the composite electronic component 10 illustrated in FIGS.1A and 1B will be described. In manufacturing the composite electroniccomponent 10, the multilayer wiring block 11, the chip-type electroniccomponent built-in multilayer block 12, the second chip-type electroniccomponent 13, and the supporting substrate 14, which have beenmanufactured in advance, are prepared. Then, as illustrated in FIG. 2A,each of the multilayer wiring block 11, the chip-type electroniccomponent built-in multilayer block 12, and the second chip-typeelectronic component 13 is aligned at a predetermined position on thesurface wiring pattern 14A of the supporting substrate 14 and thenmounted on the supporting substrate 14, as illustrated in FIG. 3A.

Subsequently, as illustrated in FIG. 2B, a resin prepreg sheet 15A in anuncured state (i.e., B-stage state) is arranged above the supportingsubstrate 14. The prepreg sheet 15A is then placed over the multilayerwiring block 11, the chip-type electronic component built-in multilayerblock 12, and the second chip-type electronic component 13, andheat-press-bonded at a temperature higher than the curing temperature ofthe uncured resin portion. This causes the resin to flow, filling aspace between each of the multilayer wiring block 11, chip-typeelectronic component built-in multilayer block 12, and the secondchip-type electronic component 13 and to cover the top surfaces of theseparts, as illustrated in FIG. 2C. Then the uncured resin portion isheat-cured so that the multilayer wiring block 11, chip-type electroniccomponent built-in multilayer block 12, and the second chip-typeelectronic component 13 are integrated by the resin portion 15. Withthis process, the composite electronic component 10 as illustrated inFIG. 3B is obtained.

Thus, according to the manufacturing method according to the presentpreferred embodiment, a substrate and an electronic component producedthrough different manufacturing processes, i.e., the multilayer wiringblock 11, the chip-type electronic component built-in multilayer block12, and the second chip-type electronic component 13, are appropriatelycombined, so that the composite electronic component 10 provided withvarious functions is manufactured.

In the first preferred embodiment, the composite electronic component 10is described, in which the multilayer wiring block 11, the chip-typeelectronic component built-in multilayer block 12, and the secondchip-type electronic component 13 are provided, and these three parts11, 12, and 13 are electrically interconnected on the supportingsubstrate 14 through the surface wiring pattern 14A. However, in thecomposite electronic component according to the present preferredembodiment of the present invention, it may be possible that, asillustrated in FIGS. 4 to 6, at least two of the multilayer wiring block11, the chip-type electronic component built-in multilayer block 12, andthe second chip-type electronic component 13 are appropriately selectedaccording to need, and the selected two parts are arranged on the samesupporting substrate 14 and electrically interconnected. Modifiedexamples will be described. In this description, the same referencenumerals as those used in the present preferred embodiment are used todesignate the same or equivalent parts.

As illustrated in FIG. 4, a composite electronic component 10A of afirst modified example is configured according to the first preferredembodiment and includes a multilayer wiring block 11, a chip-typeelectronic component built-in multilayer block 12, a supportingsubstrate 14 for supporting both the parts 11 and 12, and a resinportion 15 covering the multilayer wiring block 11 and the chip-typeelectronic component built-in multilayer block 12 on the supportingsubstrate 14. The multilayer wiring block 11 and the chip-typeelectronic component built-in multilayer block 12 are electricallyconnected through a surface wiring pattern 14A disposed on the surfaceof the supporting substrate 14. Thus, by disposing the multilayer wiringblock 11, which shares the wiring separately from the wiring pattern 12Cof the chip-type electronic component built-in multilayer block 12, to aside of the chip-type electronic component built-in multilayer block 12,the wiring pattern 12C of the chip-type electronic component built-inmultilayer block 12 can be laterally expanded. With this arrangement,profile reduction of the composite electronic component 10A is achievedin a similar manner to the first preferred embodiment.

As illustrated in FIG. 5, a composite electronic component 10B of asecond modified example is configured in accordance with the firstpreferred embodiment, and includes a chip-type electronic componentbuilt-in multilayer block 12, a second chip-type electronic component13, a supporting substrate 14 for supporting both the parts 12 and 13,and a resin portion 15 covering the chip-type electronic componentbuilt-in multilayer block 12 and the second chip-type electroniccomponent 13 on the supporting substrate 14. The chip-type electroniccomponent built-in multilayer block 12 and the second chip-typeelectronic component 13 are electrically connected through a surfacewiring pattern 14A disposed on a surface of the supporting substrate 14.For example, when the second chip-type electronic component 13 includesa coil component, the second chip-type electronic component 13 isdisposed at a side of the chip-type electronic component built-inmultilayer block 12. Thus, no wiring pattern is provided above or belowthe second chip-type electronic component 13 including the coilcomponent, and further, the second chip-type electronic component 13 issealed with the resin portion 15. Therefore, a magnetic field caused bythe coil component is not substantially affected by the wiring pattern12C of the chip-type electronic component built-in multilayer block 12.Thus, the reliability of the composite electronic component 10B isincreased. In addition, a chip-type electronic component having a coilcomponent is provided as the second chip-type electronic component 13,not as the first chip-type electronic component 12A, disposedindependently of a wiring pattern. Thus, a magnetic field based on thecoil component is hardly affected by the wiring pattern 12C of thechip-type electronic component built-in multilayer block 12. With thisarrangement, the magnetic field caused by the coil component is notsubstantially affected by the wiring pattern 12C in the chip-typeelectronic component built-in multilayer block 12. Thus, the reliabilityof the composite electronic component 10B is increased in a similarmanner to the first preferred embodiment.

As illustrated in FIG. 6, a composite electronic component 10C of athird modified example is configured in accordance with the firstpreferred embodiment and includes the multilayer wiring block 11, thesecond chip-type electronic component 13, the supporting substrate 14for supporting both the parts 11 and 13, and the resin portion 15covering the multilayer wiring block 11 and the second chip-typeelectronic component 13 on the supporting substrate 14. The multilayerwiring block 11 and the chip-type electronic component 13 areelectrically connected through the surface wiring pattern 14A disposedon a surface of the supporting substrate 14. When the second chip-typeelectronic component 13 includes a coil component, the second chip-typeelectronic component 11 is disposed at a side of the second chip-typeelectronic component 13. Thus, no wiring pattern is provided above orbelow the second chip-type electronic component 13, and further, thesecond chip-type electronic component 13 is sealed with the resinportion 15. Therefore, a magnetic field caused by the coil component isnot substantially affected by the wiring pattern 11B of the multilayerwiring block 11, and the reliability of the composite electroniccomponent 10C is increased in a similar manner to the first preferredembodiment.

Now, referring to FIG. 7 to FIG. 14, other preferred embodiments of thecomposite electronic component of the present invention will bedescribed. The same reference numerals as those in the above-describedpreferred embodiment are used to designate the same or equivalent parts.

Second Preferred Embodiment

As illustrated in FIG. 7, a composite electronic component 10D of thepresent preferred embodiment is configured in accordance with theabove-described preferred embodiment, except that it includes a shieldelectrode and a via hole conductor. Specifically, the compositeelectronic component 10D of the present preferred embodiment includes amultilayer wiring block 11, a chip-type electronic component built-inmultilayer block 12, a second chip-type electronic component 13, and asupporting substrate 14, as illustrated in FIG. 7. The multilayer wiringblock 11, the chip-type electronic component built-in multilayer block12, and the second chip-type electronic component 13 are integrated on asupporting substrate 14 by the resin portion 15 made of a prepreg sheet.The top surface of the resin portion 15 is planarized, and a shieldelectrode 16 is disposed on the planarized top surface. This shieldelectrode 16 and the supporting substrate 14 are electrically connectedthrough a via hole conductor 17 having a cross-section in the shape of acircle, an oval, or other suitable shape, for example.

Thus, the interior of the composite electronic component 10D isprotected from an external magnetic environment. In addition, the viahole conductor 17 is interposed between the chip-type electroniccomponent built-in multilayer block 12 and the second chip-typeelectronic component 13. This arrangement suppresses electromagneticinterference between the chip-type electronic component built-inmultilayer block 12 and the second chip-type electronic component 13,which are arranged side by side. Thus, the space between each of theblocks 11 and 12 and second the chip-type electronic component 13 isreduced. This enables high density implementation and, consequently,miniaturization of the composite electronic component 10D.

When the shield electrode 16 and the via hole conductor 17 are provided,the top surface of a resin prepreg sheet having metal powder, such ascopper powder adhered thereto, which is heat-press-bonded similarly tothe above-described preferred embodiment, is planarized. Then, the metalpowder on the top surface is etched into a predetermined pattern using aphoto lithography technique and an etching technique. Subsequently, avia hole is formed by irradiating CO₂ laser light onto a predeterminedarea on the resin portion 15. After a desmear process is performed oneach via hole, the via hole is filled with copper metals in the order ofelectroless copper plating and electrolytic copper plating, so that thevia hole conductor 17 is formed, and the shield electrode 16 and thesurface wiring pattern 14A of the supporting substrate 14 areelectrically connected.

As described in the foregoing, according to the present preferredembodiment, the same effects as those in the first preferred embodimentare achieved. In addition, the interior of the chip-type electroniccomponent 10D can be protected from an external magnetic environmentusing the shield electrode 16, and electromagnetic interference betweenthe chip-type electronic component built-in multilayer block 12 and thesecond chip-type electronic component 13, which are arranged side byside, is prevented. This enables a space between the parts 12 and 13 tobe reduced so that the density is increased.

Third Preferred Embodiment

A composite electronic component 10E of the present preferred embodimentis configured similar to the composite electronic component 10Dillustrated in FIG. 7, except that it does not include the supportingsubstrate 14 of the composite electronic component 10D. As illustratedin FIG. 8, the composite electronic component 10E of the presentpreferred embodiment may be disposed, for example, on a detachabletransfer sheet or a detachable transfer film (not shown). When thecomposite electronic component 10E is provided on a mounting substrate,such as a mother substrate, the transfer sheet or the transfer film isdetached from the composite electronic component 10E and provided on themounting substrate. Specifically, a metal foil such as a copper foil,for example, is detachably attached to the transfer sheet. After thesurface wiring pattern 14A is formed into a predetermined pattern usinga photo lithography technique and an etching technique, the multilayerwiring block 11, the chip-type electronic component built-in multilayerblock 12, and the second chip-type electronic component 13 are arrangedin accordance with the surface wiring pattern 14A. Then, a resin prepregsheet is press-bonded so that the multilayer wiring block 11, thechip-type electronic component built-in multilayer block 12, and thesecond chip-type electronic component 13 are integrated. Thus, thecomposite electronic component 10E is obtained. Specifically, in thecomposite electronic component 10E, implementation on a mountingsubstrate, such as a mother substrate, is performed in accordance withthe wiring pattern 14A directly connected to the external terminalelectrode of each of the blocks.

According to the present preferred embodiment, the same operationeffects as those in each of the above-described embodiments can beexpected. In addition, by creating the composite electronic component10E on the detachable transfer sheet or transfer film, the compositeelectronic component 10E can be mounted on a predetermined mountingsubstrate simply by detaching the transfer sheet of transfer film asnecessary.

Fourth Preferred Embodiment

Also in the present preferred embodiment, the preferred embodiment willbe described using the same reference numerals as those in each of theabove preferred embodiment to designate the same or equivalent parts.

-   As illustrated in (a) and (b) in FIG. 9, a composite electronic    component 10F of the present preferred embodiment has the multilayer    wiring block 11, the chip-type electronic component built-in    multilayer block 12, and the second chip-type electronic component    13. The insulating layers of each of these multilayer wiring block    11 and the chip-type electronic component built-in multilayer block    12 are formed of a thermosetting resin. The individual multilayer    wiring block 11, chip-type electronic component built-in multilayer    block 12, and the second chip-type electronic component 13 are    provided with the external terminal electrodes 11E, 12F, and 13A,    respectively, on the bottom surfaces. Each of the external terminal    electrodes 11E, 12F, and 13A have configurations according to the    external terminal electrode used in each of the above preferred    embodiments. In the present preferred embodiment, the second    chip-type electronic component 13 is sealed with a thermosetting    resin 18A in advance and configured as a chip-type electronic    component block 18 having the shape of a block. As illustrated    in (b) in FIG. 9, in the composite electronic component 10F, the    multilayer wiring block 11, the chip-type electronic component    built-in multilayer block 12, and the chip-type electronic component    block 18, each formed to have the same height, are electrically    interconnected through a first resin block 19 and a second resin    block 20 so as to be integrated. The first and second resin blocks    19 and 20 are also formed so as to have the same height as the    height of the other blocks.

Then, as illustrated in FIGS. 9A and 9B, the first resin block 19includes a laminated body 19A having a plurality of laminated insulatinglayers (for example, resin prepreg sheets) and a connecting conductor19B defining an inner conducting plate formed on a predeterminedinsulating layer in the laminated body 19A so as to extend from one sideto another side. The connecting conductor 19B is provided on both sidesof the laminated body so as to define an interface connecting theadjacent multilayer wiring block 11 and the chip-type electroniccomponent built-in multilayer block 12. The connecting conductor 19B isdefined by an inner conducting plane having a predetermined pattern. Inaddition, as illustrated in FIG. 9B, for example, a side conductingplane 11F is disposed on connecting surfaces of the multilayer wiringblock 11 and the first resin block 19 as necessary. Likewise, a sideconducting plane 12H is disposed on connecting surfaces of the chip-typeelectronic component built-in multilayer block 12 and the first resinblock 19 as necessary. Then, with these side conducting planes 11F and12H, the multilayer wiring block 11 and the chip-type electroniccomponent built-in multilayer block 12 are electrically connectedthrough the first resin block 19 with increased reliability, even ifthere is a difference in level between each of the connecting conductor19B of the first resin block 19 and the inner conducting plane 11C ofthe multilayer wiring block or the inner conducting plane 12D of thechip-type electronic component built-in multilayer block 12.

As illustrated in FIGS. 9A and 9B, the second resin block 20 isconfigured similar to the first resin block 19, and its connectingconductor 20B is disposed on both sides of a laminated body 20A. Thisconnecting conductor 20B defines the bottom surface of the laminatedbody 20A and connects the external terminal electrode 12F of thechip-type electronic component built-in multilayer block 12 and theexternal terminal electrode 13A of the second chip-type electroniccomponent 13 in the chip-type electronic component block 18.

When the composite electronic component 10F of the present preferredembodiment is produced, firstly, the multilayer wiring block 11, thechip-type electronic component built-in multilayer block 12, thechip-type electronic component block 18, and the first and second resinblocks 19 and 20 are produced. These blocks are formed so as to havesubstantially the same shape. The multilayer wiring block 11, thechip-type electronic component built-in multilayer block 12, and thechip-type electronic component block 18 are cured or fired blocks.However, the first and second resin blocks 19 and 20 are made of anuncured thermosetting resin. Then, these blocks 11, 12, 18, 19, and 20are aligned on a detachable sheet in the order illustrated in FIG. 9A.Then, these aligned blocks are heated to a temperature at which thethermosetting resin of the first and second resin blocks 19 and 20 forconnection are cured, under a state in which the surfaces of thelongitudinally opposite ends and the top and bottom surfaces of theblocks are fixed. At the same time, a predetermined pressure is appliedfrom the remaining side surfaces of the blocks so that the blocks areheat-press-bonded so as to be integrated. Then the blocks are cooled,and thus, the composite electronic component 10F is obtained. When thecomposite electronic component 10F is provided on a predeterminedmounting substrate (not shown), the composite electronic component 10Fis detached from the sheet and attached to the predetermined mountingsubstrate by soldering.

As describe in the foregoing, according to the present preferredembodiment, the same effects as those in the above-described preferredembodiments are produced. In addition, by combining the multilayerwiring block 11, the chip-type electronic component built-in multilayerblock 12, the chip-type electronic component block 18, and the first andsecond resin blocks 19 and 20, the composite electronic component 10Fwhich is suitable for various purposes is obtained.

In the present preferred embodiments, the composite electronic component10F is illustrated, in which the multilayer wiring block 11, thechip-type electronic component built-in multilayer block 12, thechip-type electronic component block 18, each having substantially thesame height, are electrically connected through the first and secondresin blocks 19 and 20, so as to be integrated. However, as illustratedin FIGS. 10 to 12, the composite electronic component of the presentinvention may be configured such that at least two of the multilayerwiring block 11, the chip-type electronic component built-in multilayerblock 12, and the chip-type electronic component block 18 areappropriately selected according to need, and the selected two parts areelectrically connected through the first resin block 19 or the secondresin block 20. An example of such a modification will be describedusing the same reference numerals as those in the present preferredembodiment to refer to the same or equivalent parts.

As illustrated in FIG. 10, a composite electronic component 10G of afirst modification example has the multilayer wiring block 11, thechip-type electronic component built-in multilayer block 12, and thefirst resin block 19 electrically connecting these parts 11 and 12. Theother features are configured according to the composite electroniccomponent 10F illustrated in FIGS. 9A and 9B. When the chip-typeelectronic component built-in multilayer block 12 includes a pluralityof the first chip-type electronic components 12A, at least a portion ofthe wiring pattern 12C of the chip-type electronic component built-inmultilayer block 12 can be shared by the multilayer wiring block 11.Thus, it is not necessary to extend the wiring pattern in the upper orlower direction. Accordingly, similar to the fourth preferredembodiment, at least a portion of the wiring pattern 12C of thechip-type electronic component built-in multilayer block 12 can beshared by the multilayer wiring block 11, and the wiring pattern 12C ofthe chip-type electronic component built-in multilayer block 12 needsnot be extended in the upper or lower direction. This facilitates areduction of the profile of the composite electronic component 10G.

As illustrated in FIG. 11, a composite electronic component 10H of asecond modification includes the chip-type electronic component built-inmultilayer block 12, the chip-type electronic component block 18, andthe second resin block 20 electrically connecting these parts 12 and 18.The other features of the composite electronic component 10H areconfigured according to the composite electronic component 10Fillustrated in FIGS. 9A and 9B. When the composite electronic componentincludes a coil component, the chip-type electronic component containingthe coil component is configured as the second chip-type electroniccomponent 13 in the chip-type electronic component block 18. With thisarrangement, the chip-type electronic component including the coilcomponent can be removed from the chip-type electronic componentbuilt-in multilayer block 12. Thus, the chip-type electronic componentincluding the coil component is provided independently as the chip-typeelectronic component block 18, and no wiring pattern is disposed aboveand below the chip-type electronic component including the coilcomponent. Further, the chip-type electronic component including thecoil component is sealed with a resin portion 18A. Accordingly, amagnetic field caused by the coil component is not substantiallyaffected by the wiring pattern 12C of the chip-type electronic componentbuilt-in multilayer block 12, similar to the fourth embodiment. Thus,the composite electronic component 10H has greatly improved reliability.

As illustrated in FIG. 12, a composite electronic component 101 of athird modification example includes the multilayer wiring block 11, thechip-type electronic component block 18, and the second resin block 20electrically connecting these two parts 11 and 18. The other features ofthe composite electronic component 101 are configured according to thecomposite electronic component 10F illustrated in FIGS. 9A and 9B. Whenthe second composite electronic component 13 in the chip-type electroniccomponent block 18 includes a coil component, the wiring portion of thesecond chip-type electronic component 13 is provided independently asthe multilayer wiring block 11 and disposed to a side of the chip-typeelectronic component block 18 through the second resin block 20. Thus,no wiring pattern is disposed above and below the second chip-typeelectronic component 13 including the coil component, and further, thesecond chip-type electronic component 13 is sealed with the resinportion 18A. Accordingly, the composite electronic component 101, inwhich a magnetic field caused by the coil component is not substantiallyaffected by the wiring pattern 11B of the multilayer wiring block 11, isobtained, similar to the fourth preferred embodiment.

As illustrated in FIGS. 13 and 14, a composite electronic component ofthe present invention is configured such that an appropriate number ofeach of the multilayer wiring block 11, the chip-type electroniccomponent built-in multilayer block 12, and the chip-type electroniccomponent block 18 are selected or an appropriate number of the blockseach including an appropriate shape are arranged, so as to beintegrated, in accordance with the functions of the composite electroniccomponent. In addition, the composite electronic component of thepresent invention can also be configured such that an appropriate numberof only the same type of blocks are arranged so as to be integrated.

Fifth Preferred Embodiment

As illustrated in FIG. 13, a composite electronic component 10J of thepresent preferred embodiment includes the multilayer wiring block 11,the chip-type electronic component built-in multilayer block 12, thechip-type electronic component block 18 each configured to havesubstantially the same height, width, and length and a resin block 21electrically and mechanically connecting adjacent blocks. These arearranged in accordance with the desired purpose and preferablyconfigured to have a substantially rectangular shape.

According to the present preferred embodiment, the same effects as thosein the fourth preferred embodiment are obtained. In addition, byappropriately combining each of the multilayer wiring block 11, thechip-type electronic component built-in multilayer block 12, thechip-type electronic component block 18, and the resin block 21, thecomposite electronic component 10J which meets various purposes isobtained.

Sixth Preferred Embodiment

As illustrated in FIG. 14, in a composite electronic component 10K ofthe present preferred embodiment, any two of the multilayer wiring block11, the chip-type electronic component built-in multilayer block 12, andthe chip-type electronic component block 18 are configured to havesubstantially the same size, and the other one is configured to have anarea which is approximately double the area of each of the two blocks.These blocks 11, 12, and 18 preferably have a substantially rectangularshape as a whole, and are electrically and mechanically interconnectedthrough a resin block 22.

According to the present preferred embodiment, the same effects as thosein the fourth preferred embodiment are achieved. In addition, byappropriately combining each of the multilayer wiring block 11, thechip-type electronic component built-in multilayer block 12, thechip-type electronic component block 18, and the resin block 22, thecomposite electronic component 10K which meets various purposes isobtained.

It should be noted that the present invention is not limited to thepreferred embodiments described above. For example, a plurality of eachof multilayer wiring blocks, chip-type electronic component built-inmultilayer blocks, and chip-type electronic components may be provided.In addition, the blocks can be made of different materials or havedifferent characteristics. In short, any composite electronic componentshaving the multilayer wiring block, the chip-type electronic componentbuilt-in multilayer block, and the chip-type electronic component, eachhaving a different function, which are electrically interconnected andarranged on the same plane, and its manufacturing method, or anycomposite electronic component in which the multilayer wiring block, thechip-type electronic component built-in multilayer block, and thechip-type electronic component are press-bonded and electricallyinterconnected through a resin block, and its manufacturing method, areencompassed by the present invention. Further, a plurality of themultilayer wiring blocks, the chip-type electronic component built-inmultilayer blocks, and the chip-type electronic components may beprovided. In addition, the blocks may be made of different materials, ormay have different materials.

The present invention is preferably applied, for example, to a compositeelectronic component used in a mobile communication device such as aportable phone and to a method of manufacturing the composite electroniccomponent.

While preferred embodiments of the present invention have been describedabove, it is to be understood that variations and modifications will beapparent to those skilled in the art without departing the scope andspirit of the present invention. The scope of the present invention,therefore, is to be determined solely by the following claims.

1. A composite electronic component comprising: a supporting substrate;at least two of a multilayer wiring block having a plurality oflaminated insulating layers and a wiring pattern, a chip-type electroniccomponent built-in multilayer block having a plurality of laminatedinsulating layers and including a plurality of first chip-typeelectronic components disposed on different ones of the plurality oflaminated insulating layers and facing in the same direction, and asecond chip-type electronic component composed of a passive component oran active component disposed on a surface of the supporting substrate;wherein the at least two of the multilayer wiring block, the chip-typeelectronic component built-in multilayer block, and the second chip-typeelectronic component are electrically interconnected and arranged on thesurface of the supporting substrate so as to be arranged insubstantially the same plane; wherein the supporting substrate includesonly one or two layers.
 2. The composite electronic component accordingto claim 1, wherein the at least two of the multilayer wiring block, thechip-type electronic component built-in multilayer block, and the secondchip-type electronic component are covered with a resin.
 3. Thecomposite electronic component according to claim 1, wherein thesupporting substrate includes a surface wiring pattern arranged toelectrically interconnect the at least two of the multilayer wiringblock, the chip-type electronic component built-in multilayer block, andthe second chip-type electronic component.
 4. The composite electroniccomponent according to claim 1, wherein the multilayer wiring block, thechip-type electronic component built-in multilayer block, and the secondchip-type electronic component are included.
 5. The composite electroniccomponent according to claim 1, wherein the at least two of themultilayer wiring block, the chip-type electronic component built-inmultilayer block, and a chip-type electronic component block in whichthe second chip-type electronic component is resin-sealed are integratedby a resin block.
 6. The composite electronic component according toclaim 5, wherein the resin block includes a connecting wiring arrangedto electrically interconnect the at least two of the multilayer wiringblock, the chip-type electronic component built-in multilayer block, andthe chip-type electronic component block.
 7. The composite electroniccomponent according to claim 5, wherein each of the multilayer wiringblock, the chip-type electronic component built-in multilayer block, andthe chip-type electronic component block are integrated by a resinblock.
 8. The composite electronic component according to claim 1,wherein the multilayer wiring block and the chip-type electroniccomponent built-in multilayer block are made of different materials.